ICES 300-SKT - Nexcom ICES 300-SKT CPU Boards-Intel Socket P, Core 2 Duo...
- Part Number:
- ICES 300-SKT
- Model Number:
- ICES-300
- Make:
- NEXCOM
- Lead Time:
- Available
- Qty In Stock:
- Available
Nexcom ICES 300-SKT CPU Boards-Intel Socket P, Core 2 Duo Family CPU COM Express ModuleICES 300 Simple Type: Embedded System
The Nexcom ICES 300 Series is a Type 2 COM Express Module featuring Intel® GME965 and ICH8M chipset, switch supports Intel® Core™ 2 Duo Merom/Core™ 2 Duo Merom LV processors with 667/800 MHz FSB and 2 x DDR2 memories with 533/677 MHz up to 4 GB. The ICES 300 supports 1 x PCI Express x 16 for superb graphic display through the carrier board; it also supports other display types include LFP, LVDS, and wide screen up to 1920 x 1200. The high performance ICES 300 COM Express Module supports 3 x SATA, 8 x USB 2.0 and 5 x PCIe x1 Lanes through the carrier board; and it is compatible with ICEB 8050 carrier board. The ICES 300 offers the high processing power and vivid graphic display solution for advanced embedded applications.
For Resellers and High Volume Orders:
Please request a quote to obtain preferred pricing.
Features
- 2 x DDR2 DIMM Socket Support Un-buffered Non-ECC DDR2
- 32 bit PCI Interface
- Gigabit LAN
- Intel® GME965 Chipset
- Intel® Socket P, Core™ 2 Duo Family Processors
- One IDE
- PCI Interface, One IDE and Gigabit LAN
- Type 2 COM Express Module Support up to 21 Express lanes
- Type 2 COM Express Module Support up to 22 Express lanes, 32 bit
Specifications
- Audio: HD Audio Interface
- BIOS: Award System BIOS Plug & Play support 4M bits fl ash ROM
- Certifications: CE approval FCC Class A
- Chipset: Intel® GME965 ICH8M I/O Controller Hub
- COM Express Connectors: AB:VGA / LVDS / 8 x USB 2.0 / HD AC’97 / 3 x SATA / LAN / GPIO / LPC / 5 x PCIeX1 / SMBus (I2C) CD:PCIeX16 (SDVO) / IDE / PCI
- CPU: Supports Intel® Socket P, Core™ 2 Duo Family Processors Supports 800 FSB CPU
- Dimensions: COM Express Extended Module Type 2, 155 mm (L) x 110 mm (W) (6.1" x 4.3")
- Display Interface: Intel® GME965 integrated graphics solution w/ Intel® Extreme Graphics 2 technology Up to 64 MB of dynamic video memory allocation One PCI Express x 16 Lane down to the carried board Drive a standard progressive scan analog monitor with resolution
- Ethernet: Intel 82573L LAN Chip Supports PXE LAN boot ROM for Ethernet Boot up Supports Wake on LAN
- Memory: 2 x DIMM, Dual channel DDR2 533/667 MHz up to 4 GB
- Operating Temperature: Board Level Operating temperatures: 0°C to 60°C Storage temperatures: -20°C to 85°C Relative humidity: Operating 10%~90%, non-condensing Non-operating 5%~95%( non-condensing)
- Power Supply: + 12 V, + 5 VSB, + 3.3 V RTC
- Processor: Intel Core 2 Duo
- RTC: On chip RTC with battery back up 1 x external Li-ion Battery RTC Torrance less than 2sec (24 hours) under 25°C environment
- System Monitor: Derived from Super IO to support system monitor Monitoring of 4 voltages, 2 temperatures and 1 fan Speed 4 voltage (For +3.3 V, +5 V, +12 V, Vcore) 2 Temperatures (CPU and one external Temperature Sensor)
Applications
- None Available
Aliases
- None Available
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